Sustainable Packaging Innovation Forum USA

27th - 28th October 2026

Chicago, USA

Sponsorship

Highlight your expertise alongside industry leaders from across the packaging value chain. Shape the agenda by developing case-study sessions highlighting your work, panels featuring your partners, and invitation-only workshops with your target audience.

Build meaningful relationships and share your expertise with an engaged audience of senior sustainability professionals from global brands, retailers, packaging manufacturers, converters, waste management operators, NGOs, finance and more.

Why sponsor this event?

Thought leadership

Highlight your expertise on the main-stage, curate a panel of your partners to launch your chosen project, or lead a debate-style roundtable to establish your expertise.

Raise awareness for your brand or project

From exhibiting in the heart of the networking area to put your brand front-and-centre, to developing a webinar or podcast to reach our global network, we create campaigns that achieve multiple touch-points with this senior audience.

Build relationships with your target audience

Choose from a variety of session formats to best meet your goals, from private invitation-only workshops, to bespoke case-studies, to support-group style roundtables, we can tailor your involvement to guarantee you meet the right stakeholders.

Who attends

We cap the number of attendees at each forum to ensure a balanced and intimate gathering of stakeholders from across the value chain.

40+ speakers

100+ attendees

Seniority

21% 19% 22% 7% 23% 8%
  • C-suite / VP / Founder
  • Director
  • Senior / Management
  • Head of / Lead
  • Advisor / Specialist
  • Other

Industry

19% 8% 19% 34% 11% 9%
  • Packaging Companies
  • Professional & Advisory Services
  • Government, Policy & NGOs
  • Retail & Consumer Goods
  • Manufacturing & Industrial Operations
  • Other

Our sponsors

Gold sponsor

Past series sponsors

Become a sponsor

Discover tailored partnership opportunities in our sponsor brochure.