The packaging fix - How to connect packaging innovation with climate action
Sustainable Packaging Innovation Forum USA
28th - 29th October 2025 - Chicago
The packaging fix - How to connect packaging innovation with climate action
14:30
-
14:30
At Innovation Forum, we take a unique, participatory learning approach to our breakout sessions, ensuring that both our expert panels and attendees contribute to the discussion. Through diverse learning formats, we foster an environment where everyone has a voice.
The Solution hubs are a space where you can get best practice from leading organisations and share insights from your business reality. We'll set the tone with a 25 min introductory panel, and dive deeper through 3 follow-up focused discussions chaired by each panelist.
Karin Witton
Tosca Packaging
Global Sustainability Director
Amy Merli
Lush
Sustainability Coordinator, North America
Get in touch
For any questions on the conference, please contact:
Registration for the Sustainable Packaging Innovation Forum is currently open. To sign up, you can do so online here, or get in touch directly for details of group discounts.
Join us for
In-depth guidance from industry leaders on how to effectively implement policies.
Networking with key stakeholders, including NGOs, business, government and supply chain actors.
An entirely off-the-record discussion that encourages open and honest disclosure from speakers and genuine participation from the audience